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TE Connectivity
KEY FEATURES
? Low Capacitance 0.20pF (typ, 200fF)
? Low leakage current –
50nA @ 5V ( typ )
? Low clamping voltage –
+9.20/-0.80V (typ) @ (tp=8x20 μ s, Ipp=2A)
? ESD – 20kV contact and air discharge
per IEC61000-4-2
? Surge – 2A (tp=8x20 μ s) per
IEC61000-4-5
? Small size and low profile XDFN Array
packages – 0.31mm height
RoHS Complaint, Pb and
Halogen Free (refers to: Br ≤ 900ppm,
Cl ≤ 900ppm, Br+Cl ≤ 1500ppm)
Multi-channel Silicon ESD Flow-Through Arrays
The Silicon ESD (SESD) arrays help provide protection and improve reliability of electronics
in applications including but not limited to consumer, portable and mobile electronics. The
multi-channel SESD ?ow-through arrays have industry leading ultra-low capacitance of
0.20pF with low insertion loss which help protect high-speed data signals. The SESD
arrays provide robust ESD protection with an industry-leading 20kV contact and air
discharge rating per the IEC61000-4-2 standard. The ultra-low capacitance SESD arrays
enable signal integrity for today’s highest-speed interfaces including USB 3.0/2.0, HDMI,
eSATA, DisplayPort, and Thunderbolt.
TE offers four- and six- channel miniature arrays which are up to 85% smaller than common
multi-channel arrays to ?t into space constrained applications. TE’s ultra-small packages
have lower parasitic impedance which reduces insertion loss at high frequencies compared
to larger size packaged devices. The four- and six-channel arrays, with 0.31mm package
height, have a 50% lower pro?le than other package options in the market. All of TE’s
SESD arrays are in ?ow-through design packages which allow for matched impedance PCB
trace routing essential for high speed signal integrity.
APPLICATIONS
? Consumer, mobile and portable electronics
? Tablet PC and external storage with high speed interfaces
? Ultra-high speed data lines
? USB 3.0/2.0, HDMI 1.3/1.4, DisplayPort interface, Thunderbolt interface (Light Peak),
V-by-One HS, and LVDS interface
? Applications requiring high ESD performance in small DFN packages
BENEFITS
? Industry-leading lowest capacitance;
provides lowest insertion loss for high speed data signals
? Provides ESD protection up to 20kV contact and air discharge per IEC61000-4-2
? Industry’s smallest footprint and lowest pro?le multi-channel ESD arrays helps to
optimize board space
? Flow-through and single connection design helps routing PCB matched impedance
high speed data lines
? Helps protect electronic circuits against damage from Electrostatic Discharge (ESD),
lightning and cable discharge events
? Assist equipment to pass IEC61000-4-2, level 4 testing
te.com
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相关PDF资料
SESD0402S-005-054 ESD PROTECT SOD-923 5.4V SILICON
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相关代理商/技术参数
SESD0402S-005-04 制造商:TE Connectivity 功能描述:ESD SUPPRESSOR 0402 10KV 0.5PF 制造商:TE Connectivity 功能描述:ESD SUPPRESSOR, 0402, 10KV, 0.5PF 制造商:TE Connectivity / Raychem 功能描述:ESD SUPPRESSOR, 0402, 10KV, 0.5PF; ;ROHS COMPLIANT: YES
SESD0402S-005-054 功能描述:ESD 抑制器 0402 PKG 5.4V .5pF SESD PROTECTOR RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
SESD0402X1BN-0010-098 功能描述:ESD 抑制器 1-CH 0402 9V Bi-Di .10pF 20kV SESD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
SESD0402X1UN-0020-090 功能描述:ESD 抑制器 1-CH 0402 9V Uni-Di .20pF 20kV SESD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
SESD05 制造商:SECOS 制造商全称:SeCoS Halbleitertechnologie GmbH 功能描述:110 W Transient Voltage Suppressors Diode
SESD07 制造商:SECOS 制造商全称:SeCoS Halbleitertechnologie GmbH 功能描述:Transient Voltage Suppressors for ESD Protection
SESD0802Q4UG-0020-090 功能描述:ESD 抑制器 4-CH MINI 9V Uni-Di .20pF 20kV SESD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
SESD099-04AT1 制造商:WILLAS 制造商全称:WILLAS 功能描述:4-CHANNEL LOW CAPACITANCE ESD PROTECTION DIODES ARRAY